搜索

430

主题

515

帖子

2106

积分

管理员

Rank: 9Rank: 9Rank: 9

积分
2106
QQ
发表于 2020-8-7 18:58:11 3168 浏览 0 回复

MPU-6881-MPU6880-register-map-寄存器手册

本帖最后由 tangh 于 2020-8-7 19:00 编辑


Product Overview


The MPU-6881 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small 3x3x0.9mm (24-pin QFN) package. It also features a 4096-byte FIFO that can lower
the traffic on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. With its dedicated I2C sensor bus, the MPU-6881 directly accepts inputs from external I2C devices. MPU-6881, with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers. MPU-6881 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I2C port. The gyroscope has a programmable full-scale range of ± 250, ± 500, ± 1000, and ± 2000 degrees/sec. The accelerometer has a user-programmable accelerometer full-scale range of g, ±4g , ±8g, and ±2±g16. Factorycalibrated initial sensitivity of both sensors reduces production-line calibration requirements. Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1% drift from -40 ° C to 85 ° C, an embedded temperature sensor, and programmable interrupts. The device features I 2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.45V, and a separate digital IO supply, VDDIO from 1.71V to 3.45V. Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For applications
requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz. By leveraging its patented and volume-proven CMOS-MEMS Fabrication platform, which integrates MEMS
wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x0.9mm (24-pin QFN), to provide a very small yet high
performance low cost package. The device provides high robustness by supporting 10,000 g shock reliability.

本帖子中包含更多资源

您需要 登录 才可以下载或查看,没有帐号?立即注册

x
手机微信同号:13682654092
回复

使用道具 举报

返回列表
您需要登录后才可以回帖 登录 | 立即注册

本版积分规则


登录或注册
快速回复 返回顶部 返回列表